• PoP-Semiconductor Packaging Goes Vertical - 6/5/2006 - Design News
  When Nokia and Amkor Technology discussed 3D packaging roadmaps five years ago, the stage was set for a new packaging solution for logic plus memory integration. Today known as Packaging on Packaging or PoP, the 3D solution addresses a wide range of multimedia applications to integrate digital baseband, application or image processors with high capacity or combination memory devices.
  When Nokia and Amkor Technology discussed 3D packaging roadmaps five years ago, the stage was set for a new packaging solution for logic plus memory integration. Today known as Packaging on Packaging or PoP, the 3D solution addresses a wide range of multimedia applications to integrate digital baseband, application or image processors with high capacity or combination memory devic
  ago amkor and discussed electronics five nokia packaging power roadmaps semiconductors stage technology test the was when years
  By sgettu in Bookmarks Toolbar Folder > Packaging > New Pkg Technologies with packaging pkg technologies nokia amkor technology discussed roadmaps
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