• Wafer Bumping
  
  As the semiconductor wafer fabricationindustry scales up to 300mm (12-inch)wafers, backend services and processesmust adapt and accommodate the largersize. One such service for flip chip packageassembly is wafer bumping, a necessarystep for creating interconnects betweenchip and substrate.Though often the equipment andprocesses to handle these wafers can simplybe scaled up from 2
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