• Amkor: CSPnl Wafer Level Packaging WL-CSP WLCSP UFBGA UltraCSP UCSP
  Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP products. Through a license from Kulicke & Soffa Inc.'s Flip Chip Division, Amkor has adopted the <EM>Ultra</EM> CSP™ as its standard wafer level package offering.
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• Dicing Saw - DISCO CORPORATION
  A dicing saw is capable of machining a semiconductor wafer into small squares, or die. A cutting saw is used to slice materials such as magnetic heads for VCRs.
  A dicing saw is capable of machining a semiconductor wafer into small squares, or die. A cutting saw is used to slice materials such as magnetic heads for VCRs.
  dicing saw saws semiconductor wafer
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• Journey to Nano Wafer Level Packaging
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• Silterra Malaysia Sdn. Bhd. : Wafer Foundry
  SilTerra Malaysia Sdn Bhd is a semiconductor wafer foundry offering major foundry compatible advanced CMOS logic, mixed-signal and RF process technologies in 0.25-micron, 0.22-micron, 0.18-micron , 0.16-micron and 0.13-micron feature sizes . In addition, Silterra offers leading edge high density, high voltage technologies. SilTerra’s wafer fab has a designed capacity of 40,000 200mm wafers per month. Environmentally vigilant, SilTerra delivers award winning, world-class performance to its customers seeking flexible capacity, competitive advantages and around the clock customer support.
  SilTerra Malaysia Sdn Bhd is a semiconductor wafer foundry offering major foundry compatible advanced CMOS logic, mixed-signal and RF process technologies in 0.25-micron, 0.22-micron, 0.18-micron , 0.16-micron and 0.13-micron feature sizes . In addition, Silterra offers leading edge high density, high voltage technologies. SilTerra’s wafer fab has a designed capacity
  0.13 0.16 0.18 0.22 0.25 advanced ch cmos fab fabrication foundry glc khazanah micron process sbk semiconductor silterra wafer
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• Used, Refurbished and Surplus Wafer Fabrication Equipment
  Used and Surplus Equipment: Wafer Fabrication
  Used, Surplus, Refurbished Semiconductor Manufacturing Equipment and Facilities Equipment, Parts, Accessories and Supplies For Sale. Find Wafer Fabrication such as Thermal Processing, Chemical Vapor Deposition, Physical Vapor Deposition, Plasma Processing, Ion Beam, Lithography, Ion Implantation, Laser Based Tools, Wet Processing, Chemical Mechanical Planarization, Wafer Grinding,
  applied bold branson gasonics group inc mactronix materials mgi nikon novellus silicon sumitomo sun systems technologies valley
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• Wafer Bumping
  
  As the semiconductor wafer fabricationindustry scales up to 300mm (12-inch)wafers, backend services and processesmust adapt and accommodate the largersize. One such service for flip chip packageassembly is wafer bumping, a necessarystep for creating interconnects betweenchip and substrate.Though often the equipment andprocesses to handle these wafers can simplybe scaled up from 2
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